Products

Liquid Cooling | For Existing and Evolving Data Centres

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Manifolds

Tate’s Liquid Cooling Manifolds deliver coolant from the CDU to the coldplate, enabling direct-to-chip liquid cooling for high-density data centres. By regulating flow, pressure, and temperature, they ensure even heat dissipation across all servers, improving efficiency and performance.

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Integrated Solution
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Ceiling Supported Manifolds

Tate’s Ceiling suspended HAC and integrated liquid cooling manifolds act together as one integrated cooling solution, supporting multiple mounting options, including a multi-arm cantilever system that simplifies cable tray installation.

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Integrated Solution
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Floor Mounted Manifolds

Installed withing the Tate Hot Aisle Containment System (HAC), these manifolds are ideal for high density environments where space and performance matter most. Their integrated design delivers liquid cooling right at the source ensuring thermal efficiency for AI and HPC workloads. 

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Integrated Solution
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Underfloor Manifolds

Designed for both new builds and retrofit, modular underfloor manifolds route cooling below the raised floor, minimising disruption and supporting fast installation. A practical options for scaling capacity while maintaining uptime. 

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Integrated Solution
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Floor Supported and Custom Configurations

When a standard layout isn’t enough, our floor-supported and hybrid options provide flexibility for any site-specific constraint. These solutions adapt to unique layouts, combining in rack and underfloor or custom routing without compromising performance scalability or accessibility. 

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Liquid Cooling Manifolds

Enabling AI Data Centres

Direct-to-chip liquid cooling offers the efficiency needed to handle today’s heat loads and prepare for tomorrow.

Tate makes the transition simple with precision-engineered manifolds, Hot Aisle Containment integration, and underfloor distribution. Designed in-house, fully tested, and supported worldwide, our solutions ensure reliable performance in any data centre.