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Artificial intelligence (AI) has long captivated human imagination, but recent advancements in compute power have transformed AI from science fiction to reality.

Understand how manifolds, and their integration hold the key to direct to chip cooling in high density data centres.

As artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC) workloads continue to grow in scale and intensity, data centers around the world are facing a new thermal frontier.